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SG7350D
Characteristic
●Glass-reinforced PTFE and ceramic dielectric.
●Excellent high frequencyperformance.
●Enhanced thermalconductivity.
●Stable electricalproperties versus frequency.
●Low Z-axis expansion andexcellent dimensional stability.
●Compatible with lead-freeprocess.
Application Area
Passive Components；
Power Amplifiers；
Microwave Combiner and Power Dividers；
LNA/LNB；
- Product Performance
- Product Certificate
- Data Download
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Process Dk | IPC-TM-650 2.5.5.5 [1] | 10GHz/23℃ | - | 3.55 |
| Process Df | IPC-TM-650 2.5.5.5 [1] | 10GHz/23℃ | - | 0.0022 |
| TcDk | IPC-TM-650 2.5.5.5 | -25°C to 125°C | ppm/°C | -14 |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | A | MΩ·cm | 5.8 x 106 |
|
Surface Resistivity |
IPC-TM-650 2.5.17.1 |
A | MΩ | 2.9 x 107 |
| Td | ASTM D3850 | TGA (5% W.L) | ℃ | 565 |
| CTE (X/Y/Z-axis) | IPC-TM-650 2.4.24 | TMA (30-260℃) | ppm/℃ | 9/8/25 |
|
Peel Strength |
IPC-TM-650 2.4.8 |
after solder float |
N/mm [ln/in] | 0.90 [5.14] |
| Water Absorption | IPC-TM-650 2.6.2.1 | D-24/34 | % | 0.05 |
| Thermal Conductivity | ASTM D5470 | 100℃ | W/m·K | 0.80 |
| Flexural Strength (X/Y-axis) | IPC-TM-650 2.4.4 | A | MPa | 100/80 |
|
Flammability |
UL-94 | C-48/23/50 | Rating | V-0 |
Remarks:
(1) All the typical valueis based on the 0.508mm(0.020”) specimen, and the specification sheet is basedon IPC4103.
(2) Typical values are a representation of anaverage value for the population of the property.