On December 24^th, 2018, 5G Mobile Phone Electronic Material Technology Trend Outlook Forum was grandly held in Shengyi Technology Co., Ltd.

This event is host by Dongguan High-Tech Industry Association (Electronic Information Industry Committee), and jointly organized by the National Engineering Research Center of Electronic Circuits Base Materials (the Center), Shengyi Technology Co., Ltd. and Vivo Communication Technology Co. Ltd. Secretary Mr. Zhuo Qing and Section Chief Mr. Zhong Jingping of the High-tech Section of Dongguan Science and Technology Bureau, and Secretary General Mr. Xia Zhengchang of Dongguan High-tech Industry Association attended the event as representatives of the host. Chairman Mr. Liu Shufeng, Chief Engineer Mr. Zeng Yaode, Sales & Marketing Director Mrs. Zeng Honghui, Operation Director Mr. Wu Xiaolian and Director Mr. Yang Zhongqiang of the Center and others of Guangdong Shengyi attended as organizers. A number of famous end customers and PCB/FPC companies in the industry were invited, including Amazon, Vivo, Oppo, MEIZU, Avary Holding, AT&S, Multek Flexible Circuit, Founder (Zhuhai), Meiko (Wuhan), BYD, Sunway Communication. About 70 companies and 250 people attended the forum.

Chief Engineer Mr. Zeng Yaode of Guangdong Shengyi host the forum. Secretary Mr. Zhuo Qing of Dongguan Science and Technology Bureau attended the meeting and made a speech. Chairman Mr. Liu Shufeng of Guangdong Shengyi delivered a welcome speech to all the participants as the organizer representative. People of relevant industries concerned much about this forum and the meeting site was full of people.

Forum Topic One: Key Technologies and Networking of 5G

Mr. Zhang Guanghui, a wireless expert at China Telecom Beijing Research Institute, first outlined the mobile communication development and three application scenarios of 5G applications (eMBB enhanced mobile broadband scenario, mMTC low-power large connection scenario, and uRLLC low latency high reliability scenario). Then, he introduced the key technologies and networking of 5G in an easy-to-understand way, including 5G standard plan, key technical indicators, 5G spectrum and other technologies and requirements, and that the wireless network architecture will also undergo major changes. Compared with 4G terminals, in the face of the needs of diverse scenarios, 5G terminals will develop along morphological diversification and technical performance differentiation.

Forum Topic Two: 5G Mobile Phone Terminal PCB/FPC Technology Outlook

Mr. Xie Changhong, Director of Mobile Phone Device Development Department of Vivo, has many years of experience in FPC/PCB device development of mobile phone, and has a deep understanding of PCB and FPC required for 5G mobile phone terminals. Mobile phone is a representative of thin, light and small consumer products. Mr. Xie explored and shared the main design methods of Apple, Samsung, Huawei, OPPO and Vivo. For mobile phone PCB/FPC in the future, space saving, high heat dissipation, high frequency and high speed, EMC upgrade and other technical requirements related to material, as well as design and process were introduced in depth. Meanwhile, he also made clear demand analysis of the motherboard stack, SIP package, heat dissipation technology, LCP/MPI base material, fluororesin technology and other advanced technical solutions and more upstream copper foil characteristics. In the future, mobile phones will develop rapidly in the direction of high density, integration, modularization, thinning, thermal optimization, multi-layering, high-frequency, high-speed, and special functions.

Forum Topic Three: 5G Base Materital Solutions

Every generation of material determines the technology of the generation. As the cornerstone of the electronic circuit and information industry, the performance of CCL is very important in the 5G era. SYTECH has been working in CCL for various applications for more than 30 years. It has rich technical accumulation and forward-looking roadmap to develop and produce, and has reserved a large number of base material technology solutions for the future 5G mobile phone market. Focusing on the basic research in the field of CCL, SYTECH has provided a complete range of base material technology solutions for mobile phone.

Mr. Wu Hongkui, Technical Director of SYTECH’s flexible material, made his report on FCCL Solutions in the Age of 5G Communication. He shared MPI, cover film, self-coating solution LCP technology platform, molten LCP resin and LCP film, self-coating modified fluororesin technology platform and other relevant technologies and product applications in detail. SYTECH is filling the domestic gap step by step in this field.

In terms of rigid CCL materials for mobile phone HDI application, Mr. Qi Hao, a senior market development engineer from Guangdong Shengyi, has been focusing on mobile phone HDI technology for many years. He knows all kinds of base material technology for mobile phone motherboards. In addition to conventional halogen-free base materials and base material solutions applied to mSAP and Low Dk SLP, he also brought 7 refreshing new base material technology solutions in the technical fields of heat dissipation, ultra-thin RCC, Semi-flex base material, motherboard stacking, etc., which are in line with the motherboard technology trends shared by Vivo.

Mr. Sun Peng, a senior market development engineer of Guangdong Shengyi, introduced the application of package base material in HDI. The demand for thin and light mobile phones drives the mobile phone motherboard from traditional through-hole board to HDI, then from HDI/Anylayer to mSAP, and how will the mobile phone motherboard technology develop in the future? Coreless, embedded technology, SAP process, hybrid process, and so on are all representatives of advanced technology.

During the free discussion session, guests raised technical issues of different materials on the 5G development. Chief Engineer Mr. Zeng Yaode of Guangdong Shengyi, Mr. Zhang Guanghui of China Telecom Beijing Research Institute, and Director Mr. Xie Changhong of Mobile Phone Device Development Department of Vivo answered their questions.

The forum came to an end with a visit of the Center and the production line of Guangdong Shengyi in the afternoon.